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INNOVATIVE TECHNOLOGY FOR INTERFACE EVALUATION:

3D TOPOGRAPHY AND DEFORMATION MEASUREMENTS

High and Low Temperature Warpage (z) and In-Plane (x,y) Deformation Measurement for Components, PCB’s and Assemblies.

TDM Applications: Dynamic Deformation Mapping, Thermal Relaxation Analysis, Moisture/Reflow Control, CTE quals, Device Aging Analysis, PCB Soldering Optimization, Thermal Studies of On/Off Cycles, Heat Sink Effect



Grenoble, France

www.insidix.com